Epo-Tek ET301-2FL General Room Temp Cure Epoxy (2.5G)

EPO-TEK® 301-2FL is a two-component epoxy that can be cured with or without heat. It is specifically designed for bonding optical components because of it clarity and low florescence. This low-stress adhesive has a low viscosity, a long pot life (12 hrs.) and good handling characteristics. It is a compliant adhesive that is resistant to impact or vibrations.

Advantages and Suggested Application Notes:

• Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.
• Ease of use: potting and casting, encapsulation, and adhesive.
• Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level.
• Compliant adhesive that will be resistant to impact or vibrations. Low-stress adhesive for bonding optics inside OEM / scientific instruments.
• Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light. Adhesion to glass, quartz, metals, wood and most plastics is very good.
• May also be used for impregnating wooden or porous objects for artifact restoration.
• Capable of both heat cure and room temperature cure.

See physical, optical and electrical/thermal properties in the datasheet.