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Epo-Tek® ET302-3M General Room Temp Cure Epoxy (2.5G)
ET302-3M-2.5G
Epo-Tek® ET302-3M General Bonding, Room Temperature Cure, 2-Part Epoxy, 2.5 Gram Packet
EPO-TEK 302-3M is a two-component, 100% solids epoxy that may be cured at room or elevated temperatures. The 302-3M exhibits excellent optical properties and is particularly effective against moisture and water.
Advantages and Suggested Application Notes:
Advantages and Suggested Application Notes:
- Low viscosity, clear and colorless epoxy is well suited for potting applications, and for transmitting VIS or NIR light in opto-circuits.
- Excellent water, chemical, and solvent-resistant properties including 10% nitric acid, acetone, hexane, and dicholormethane.
- Fiber Optic/Optical Application:
- Potting and encapsulation; lens and prism bonding for Scientific / OEM instruments; LED encapsulant.
- Transmission in the VIS/NIR range from 350 – 1550 nm. Can be used in the optical pathway
- Potting or sealing the fiber into the snout of the opto-package.
- Adhesive for V-groove, fiber arrays or lens arrays.
- Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic.
- Semiconductor Application:
- Recommended for underfilling of flip chips or SMDs on PCB; can also be used for COB glob top process using a DAM/FILL method; can resist 85/85 moisture soaks, as well as Tcycles and Tshocks
- Passes NASA low outgassing standard ASTM E595 with a proper cure.
