Epo-Tek® ET353ND Heat Cure Epoxy (2.5G)

EPO-TEK® 353ND is a two-component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK brand products and is known throughout the world for its performance and reliability. Also available in single component frozen syringe 2.5g packet.

Advantages and Suggested Application Notes:

• Reasonable pot life that allows for low-temperature curing to be realized. It has an amber color change upon cure.
• Passes NASA low outgassing standard ASTM E595 with a proper cure
• Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
• Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high-temperature packaging.
  • Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions.
• Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
  • Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.
  • Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
• Electronics Assembly suggested applications:
  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
  • Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets.

See physical, optical and electrical/thermal properties in the datasheet.