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Epo-Tek® H70E Thermally Cond. Heat Cure Epoxy (4G)

ETH70E-4G
Epo-Tek® H70E Thermally Conductive, Electrically Insulating, Heat Cure, 2-Part Epoxy, 4 Gram Packet
EPO-TEK¨ H70E is a 100% solids, two component, thermally conductive but electrically insulting epoxy designed for chip bonding in microelectronic and optoelectronic applications. It is particularly recommended where good heat dissipation in the device is necessary.

EPO-TEK H70E is a soft, slightly flowable paste. The excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents. In addition to the good thermal conductive and the short curing cycles, EPO-TEK H70E is extremely easy to use. The thermally conductive filler is dispersed in both the resin and hardener and the system is designed so that it can be used in a convenient 1:1 mixing ratio by volume that is not critical.